溅射镀膜 Sputter - Lesker Lab18
2015-11-09 14:51:09    点击:

型号:科特莱斯科LAB18

用途:沉积多种金属、介质材料

原理:氩原子电离后在电场的作用下,轰击靶材,将靶材元素沉积到样品表面。

技术指标:

        样品尺寸:最大可支持6英寸

        配有进样室

        支持金、铂、钛、铝、镍、银、铜、二氧化硅、氮化硅、氧化铝等多种金属和非金属材料的镀膜需求


Mode:KertLeskerLAB18

Uses: Deposition of a variety of metallic and dielectric materials

Principle: Ionized argon atomic under the action of electric field,  bombard  the target material,  make the target element deposit to the sample surface.

Specifics

        Sample Sizemaximum 6 inch

        Load-Lock

        Support many kinds of metallic and dielectric

        materialssuch as Au, Pt, Ti, Al, Ni,Ag,Cu,

        SiO2,Si3N4, Al2O3 etc.